http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10157000-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D65-40 |
| filingDate | 1997-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ace7d4fb7c063509ca05d22a1f912cc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73a12df176952ceeb25be24b35f04369 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bc1ac114d9bc1b270e048e8b543d6dc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c044f072fb3d4c4dcb05c6eed3de213 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4fa4a881f6a8977adb052aeada7c5690 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66a998052f634ff911f2e3f1fe010b70 |
| publicationDate | 1998-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10157000-A |
| titleOfInvention | Gas barrier laminated film |
| abstract | PROBLEM TO BE SOLVED: To provide a gas barrier laminated film having both excellent strength properties and gas barrier properties and moisture proof properties, without impairing excellent gas barrier properties even after boiling treatment, and also having good heat sealability. I do. SOLUTION: This is a laminated film having at least three layers of a polyamide resin film layer, an inorganic vapor deposition layer, and a polyolefin resin film layer, and satisfies the following conditions (1) to (3). Gas barrier laminated film. (1) The compression elastic modulus in hot water at 95 ° C. per unit sectional area of the polyolefin resin film layer is 8 kgf / mm 2 or more. (2) The Vicat softening point of the polyolefin resin film layer is 145 ° C. or less. (3) The shrinkage rate (%) of the laminated film in hot water at 95 ° C. is less than 0.7 times the shrinkage rate (%) of the polyamide resin film layer in hot water at 95 ° C. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007015725-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011126603-A |
| priorityDate | 1996-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.