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filingDate 1997-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95140663037e19701eae26904751e23b
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publicationDate 1998-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10154673-A
titleOfInvention Cerium oxide abrasive and substrate polishing method
abstract (57) [Problem] To provide a cerium oxide abrasive for polishing a surface to be polished such as an SiO 2 insulating film without damage. SOLUTION: SiO 2 produced by a TEOS-CVD method The maximum particle diameter of the slurry in which the cerium oxide particles are dispersed in the medium is 1000 nm. Polish with the following slurry abrasive.
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