http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10150277-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_097405822d505467fd50f7100022cd56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F265-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1996-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89a49ec4760731a9c316c51679b55920 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85b9bc456cb06fd0a355dc957310fae0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1b14efd91d89278e6a427e811f2d038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94435ab227f326190f3eeaf45b14b21a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_540bc7dfecf4c2881fa3b2dd98373916 |
| publicationDate | 1998-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10150277-A |
| titleOfInvention | Manufacturing method of multilayer printed wiring board |
| abstract | (57) [abstract] (with correction) [PROBLEMS] A material suitable for an insulating resin for printed wiring boards that prevents cracks and voids and achieves both impact resistance, heat resistance, and electrical insulation reliability. provide. SOLUTION: An alkali-soluble (meth) acrylic polymer composition is applied to a roughened surface of a copper foil 1 to form a copper-clad insulating sheet 3, a plating through hole 8 and a conductive circuit pattern 4 are formed. A step of forming a buried via hole and forming an interlayer insulating layer by laminating the copper-clad insulating sheet 3 on the inner layer panel 7 having a step of forming fine holes in the copper foil 1 by etching; A step of forming a blind via hole by dissolving the composition 2 with an aqueous alkali solution, electron beam irradiation and heating to form the resin composition 2 And a step of forming a conductive material in the blind via hole and electrically connecting the conductive circuit pattern 4 of the inner layer panel 7 to the surface copper foil. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11445611-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103917047-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019080209-A1 |
| priorityDate | 1996-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.