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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-24
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filingDate 1996-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_004f6c62e7da3512d23aa4b3c6aeb2f1
publicationDate 1998-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10140004-A
titleOfInvention Resin composition for polymer thermosensor and polymer thermosensor
abstract PROBLEM TO BE SOLVED: To provide a high-temperature sensitive and highly reliable polymer thermosensitive material which has improved temperature dependency and long-term stability, has little change due to moisture absorption. SOLUTION: A resin composition for a thermosensitive polymer is modified with a polyamide resin (homologous or copolymer of polyamide 11 or polyamide 12) and an olefin resin (epoxy group, carboxyl group, acid anhydride group or the like). Modified olefin resin). The ratio of the olefin resin is about 0.1 to 60 parts by weight based on 100 parts by weight of the polyamide resin. The resin composition further contains about 0.01 to 10 parts by weight of a conductivity-imparting agent (such as a conductivity-imparting agent composed of a polyalkylene oxide and a metal salt) based on 100 parts by weight of the polyamide resin. Is also good. The resin composition may further include about 0.1 to 40 parts by weight of a phenol resin with respect to 100 parts by weight of the polyamide resin.
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priorityDate 1996-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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