http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10139573-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-5127 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-009 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B41-88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B41-51 |
| filingDate | 1996-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b3ed848410e3631454bbea93324a1c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04ca1cccd6fd29610251206f16fe1bd4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d2bfab68d1046c14ff02378b4c85318 |
| publicationDate | 1998-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10139573-A |
| titleOfInvention | Underlayer for copper metallization on ceramic substrate |
| abstract | (57) [Summary] [Problem] To provide a base layer formed at the time of metallizing copper on a ceramic substrate, which has a strong adhesion even if copper metallization is performed without roughening the surface of the ceramic substrate. Provided is an underlayer that enables a conductive layer to be obtained. SOLUTION: This is an underlayer previously formed on the surface of the ceramic substrate when copper metallization is performed on the ceramic substrate by plating, and a film containing each element of copper, bismuth and magnesium formed on the surface of the ceramic substrate is provided. An underlayer that is heat-treated in an oxidizing atmosphere and then immersed in a reducing solution and subjected to a reduction treatment. Further, in the above copper metallization underlayer, an underlayer whose film also contains an aluminum element. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4632580-B2 |
| priorityDate | 1996-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.