http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10135639-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38520f366e74704305b34fb93a81121e http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_87d3c90bf87558ab99a0b143b2d1396f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1996-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d026d8997ef7ac59d2769440c1b84c0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ab1ed4a9278888500e0ba8442e4ea47 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_430ada6d4f8ac1e9815925cd0f18f546 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50b0864338b2689f22facda50cac5155 |
| publicationDate | 1998-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10135639-A |
| titleOfInvention | Method for manufacturing multilayer printed wiring board, interlayer connection method, and multilayer printed wiring board |
| abstract | (57) [Summary] [Problem] To increase the number of layers easily, obtain sufficient adhesion between the resin layer and the upper layer wiring, shorten the manufacturing process and reduce the cost, and achieve the interlayer connection. Provided is a method for manufacturing a multilayer printed wiring board with improved reliability. After forming a resin layer covering a lower wiring on a wiring board, a copper foil to be formed as an upper wiring in a later step is placed on the resin layer. Thereafter, press lamination is performed to press the copper foil against the resin layer 16 and the head 14 a of the columnar conductor 14. Thereafter, a portion of the copper foil located at the head 14a of the columnar conductor 14 is removed by etching using a resist pattern for forming an opening to form an opening exposing the head 14a of the columnar conductor 14. Thereafter, the head 14 a of the columnar conductor 14 is subjected to electrolytic copper plating to deposit copper from the end of the copper foil, and then copper is further deposited on the head 14 a of the columnar conductor 14 to form an interlayer connecting portion 32. To form Thereafter, the copper foil is subjected to an etching process to form an upper wiring. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0052977-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005340785-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6555209-B1 |
| priorityDate | 1996-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.