| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f75c33ae35e5d1dc4b05e62ec461c17f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0796
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1453
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-167 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
1997-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79949adc1e28436ddd9352a1172c5e5d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbbae1b592a7871ccbaa38c74c06a1f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb1daf3243f9dda767a84f97f66fe08c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d53006ad8d1a184a9b64bb82dbcc8f16 |
| publicationDate |
1998-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H10135608-A |
| titleOfInvention |
Method of manufacturing printed circuit board with plated resistors |
| abstract |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a double-sided or multilayer printed circuit board having a printed plated resistor, wherein the resistor is used as an integral part of the circuit of the printed circuit board in an efficient and economical manner. And can be printed and plated, resulting in further minimization of the printed circuit board as compared to those manufactured by conventional methods. A resistive material is plated on an insulating substrate between conductive regions such that the resistive material connects the conductive regions, and the surface of the insulating substrate is plated before the resistive material is plated. Homogenization and homogenization of the insulating substrate by etching and oxidation of the plated resistors improve the uniformity and consistency of the plated resistors. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4687084-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006253710-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005002303-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006165083-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7453702-B2 |
| priorityDate |
1996-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |