http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10130469-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 |
| filingDate | 1996-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34cec11e5fd47d140b3570ac08a7353c |
| publicationDate | 1998-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10130469-A |
| titleOfInvention | Epoxy resin composition |
| abstract | (57) [Summary] (Modified) [PROBLEMS] An epoxy resin composition for semiconductor encapsulation that is excellent in the filling property of a semiconductor thin package, can form a package without burr generation, and has excellent solder resistance of the formed package. Offer. (A) an epoxy resin containing the epoxy resin represented by the general formula (1) in an amount of 30% by weight or more in a total epoxy resin, (B) a phenol resin curing agent having a melt viscosity at 150 ° C. of 5 poise or less, In the epoxy resin composition for semiconductor encapsulation containing C) fused silica powder and (D) a curing accelerator as an essential component, the fused silica powder of the component (C) accounts for 75 to 93% by weight of the total resin composition. , Particle size 15 0.2% by weight or less of particles of 0 μm or more, particle diameter of 75 μm An epoxy resin composition for semiconductor encapsulation wherein the above particles have a specific particle size distribution of 2% by weight or less and the spherical silica powder is 70% by weight or more. (R is H, a group selected from C 1-9 alkyl groups and halogen atoms.) |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4710195-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001151988-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003048957-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003012895-A |
| priorityDate | 1996-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.