| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
1996-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_857a858428dd6c4189a7b99b23c99808
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_572d6646a763b21f842b471f8f0ee6ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b280d12b47fcbcbafa354dd7a30f84c |
| publicationDate |
1998-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H10130370-A |
| titleOfInvention |
Epoxy resin composition and semiconductor encapsulating material |
| abstract |
PROBLEM TO BE SOLVED: To exhibit excellent moisture resistance and fluidity together with excellent flame retardancy, and to have both flame retardancy and solder crack resistance especially as a semiconductor encapsulating material. A brominated dicyclopentadiene type epoxy resin having a binuclear content of 35% by weight or less is mixed with a cresol novolak type epoxy and a curing agent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005536590-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03029323-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100570725-B1 |
| priorityDate |
1996-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |