| abstract |
PROBLEM TO BE SOLVED: To provide a low-cost, small-sized, and excellent electric characteristic I. Provided are a C package, a large-area, multi-pin IC prober, a connector for connecting with good electrical characteristics, and a method of manufacturing them. SOLUTION: When a resin of minute projections called bumps 1 for contacting an electrode such as an IC is formed by injection molding at the same time as an organic substrate 2, the man-hour is reduced and the cost is reduced. . Also, by forming the through holes 3 in the organic substrate 2, wiring to the BGA electrodes is facilitated, and the outer shape of the IC package can be reduced even with a large number of pins. The substrate having the bumps 1 is connected to a supporting substrate to form an IC prober. In addition, bumps are formed on both surfaces of the organic substrate 1 to form a connector. |