http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10125671-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
filingDate 1996-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35e1df569c623313084e0f35a17e900e
publicationDate 1998-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10125671-A
titleOfInvention Organic insulating film material and method of manufacturing the same
abstract (57) [Problem] To provide an organic insulating film material which can be used for forming an organic insulating film having a sufficiently small relative dielectric constant, and a method for manufacturing the same. SOLUTION: An organic insulating film material made of an organic polymer formed by bonding a large number of aromatic rings having a substituent of a fluoride via oxygen is formed. Specifically, the organic insulating film material is formed. The repeating unit of the organic polymer is a substance represented by the following formula (1). In addition, this organic insulating film material is prepared by adding pyridine, copper chloride (I), and nitrobenzene to a reactor and stirring the mixture, further introducing oxygen into the reactor, and converting o-trifluoromethylphenol to nitrobenzene as a solvent. After dissolution, this solution was added to the reactor together with stirring and reacted at room temperature for 50 hours. Thereafter, nitrobenzene was distilled off, pyridine was removed, and the product was sufficiently washed with water, dehydrated with anhydrous magnesium sulfate, and vacuum-dried. Embedded image
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004002627-A
priorityDate 1996-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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