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filingDate 1996-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_130fa36c918d3131ee280ec0dc2085a6
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publicationDate 1998-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10120880-A
titleOfInvention Resin composition and molded product thereof
abstract (57) Abstract: Moldability, comprising a polymer composition as component (A) and conductive carbon as component (B). A resin composition having conductivity, heat resistance and decomposability. [Effect] The resin composition according to the present invention and the molded product thereof exhibit the following effects. It has the same excellent moldability as ordinary polylactic acid. That is, at the time of molding, injection molding can be performed at Tg (glass transition temperature) or lower or near room temperature. Has excellent heat resistance. That is, immediately after molding, the crystallization speed of the molded product is high and the degree of crystallization is high. When a molded product is used, it has excellent heat resistance, and the polymer component does not deteriorate. Has excellent degradability. That is, it has excellent degradability after disposal.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7297431-B2
priorityDate 1996-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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