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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D01F6-62
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filingDate 1996-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4112822e023af8a8441c08054252da18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fe58c2deda33f29de64c2aba49b91a8
publicationDate 1998-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10110312-A
titleOfInvention Pad material having improved organic solvent resistance and method for producing the same
abstract (57) [Summary] (with correction) [PROBLEMS] To provide a pad material having good elasticity and texture and improved organic solvent resistance, and a method of manufacturing the same. SOLUTION: The aggregate of short fibers A occupies 40 to 80% by weight based on the weight of the pad material, and at least two of the following heat-adhesive conjugate short fibers B and heat-adhesive conjugate short fibers C are used. A pad material which is dispersed and mixed as a fusion component in a fiber structure, and in which thermal fixation points as shown in (a) to (e) are scattered in the pad material. (B) Short fiber A and short fiber B (B) Short fiber A and short fiber C (c) Short fiber B and short fiber C (d) Short fibers B (e) Short fibers (C). B: Short fiber in which a thermoplastic elastomer as a fusion component having a melting point lower by 40 to 150 ° C. than the melting point of the inelastic polyester polymer constituting the short fiber A is exposed at least on the surface. C: Short fiber in which a crystalline polyolefin polymer as a fusion component having a melting point lower by 25 to 130 ° C. than the melting point of the polymer constituting the short fiber B is exposed at least on the surface.
priorityDate 1996-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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