| abstract |
(57) [Problem] To provide a via filling composition with little shrinkage during drying / curing, high conductivity, and excellent mechanical strength. Also, the via filling method must be reliable and inexpensive. SOLUTION: An electrolytic and electroless method using a solid plug polymer thick film composition for filling a through hole, and the composition. The composition is a trimodal conductive mixture dispersed in an organic vehicle, wherein the trimodal conductive mixture comprises spherical silver, flake silver, and silver-coated copper. |