http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0980116-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
filingDate | 1995-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27ce1ad5d29ef0225dfede091f17521c |
publicationDate | 1997-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H0980116-A |
titleOfInvention | Socket for semiconductor chip |
abstract | (57) Abstract: It is an object of the present invention to perform an electrical characteristic inspection of a semiconductor device in a bare chip state in an electrical characteristic inspection of a semiconductor device. A semiconductor chip socket. In contrast to the wire bonding method that uses a ceramic package in the past, the probing method that uses a probe installed on the socket lid is used. The socket lid is provided with a probe 102 for making contact with the electrode terminal of the bare chip. The positioning mechanism 104 has a stage 105 that can move back and forth, left and right, and up and down, and performs positioning and probing by image processing through the camera 101. The stage 105 is provided with a compressed air mechanism 103 for fixing the bare chip. [Effect] Since contact is made by probing, short-circuiting between adjacent terminals at the time of re-bonding in a state where bumps are crushed is reduced, and reliable quality confirmation is possible. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105067847-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4562680-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007278909-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012237645-A |
priorityDate | 1995-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985 |
Total number of triples: 19.