http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0980116-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 1995-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27ce1ad5d29ef0225dfede091f17521c
publicationDate 1997-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0980116-A
titleOfInvention Socket for semiconductor chip
abstract (57) Abstract: It is an object of the present invention to perform an electrical characteristic inspection of a semiconductor device in a bare chip state in an electrical characteristic inspection of a semiconductor device. A semiconductor chip socket. In contrast to the wire bonding method that uses a ceramic package in the past, the probing method that uses a probe installed on the socket lid is used. The socket lid is provided with a probe 102 for making contact with the electrode terminal of the bare chip. The positioning mechanism 104 has a stage 105 that can move back and forth, left and right, and up and down, and performs positioning and probing by image processing through the camera 101. The stage 105 is provided with a compressed air mechanism 103 for fixing the bare chip. [Effect] Since contact is made by probing, short-circuiting between adjacent terminals at the time of re-bonding in a state where bumps are crushed is reduced, and reliable quality confirmation is possible.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105067847-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4562680-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007278909-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012237645-A
priorityDate 1995-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985

Total number of triples: 19.