| abstract |
(57) Abstract: An epoxy resin composition having excellent solder heat resistance, moisture resistance reliability, moldability, and adhesiveness and improved reliability while preventing the generation of package cracks in the surface mounting process of a semiconductor device. To provide a resin-sealed semiconductor device. An epoxy resin composition containing an epoxy resin, a curing agent, and a filler, wherein the curing agent has two or more aromatic groups to which a hydroxyl group is directly bonded, and an aliphatic group between the aromatic groups. An epoxy resin composition containing, as an essential component, a phenol compound in which a cyclic group is interposed, and a resin-encapsulated semiconductor device using the epoxy resin composition. |