http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0964544-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 |
| filingDate | 1995-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f76ed5b52a4a67c1897ffbef5e811a4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4b211de01b69e5819e79ce55752c07c |
| publicationDate | 1997-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0964544-A |
| titleOfInvention | Multilayer printed wiring board and method of manufacturing the same |
| abstract | (57) Abstract: A multilayer printed wiring board having a high-definition pattern and a manufacturing method capable of manufacturing such a multilayer printed wiring board by a transfer lamination method onto a substrate without including a photolithography process. And how to provide. SOLUTION: A conductive pattern and an insulating electrolytic polymer film are formed by sequentially performing an operation of transferring a wiring pattern layer provided on a wiring pattern layer transfer plate onto a substrate, for a plurality of wiring pattern layer transfer plates. The wiring pattern layer which it has is formed on a board | substrate, and it is set as a multilayer printed wiring board. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015111753-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9751754-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001226777-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015111753-A1 |
| priorityDate | 1995-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.