http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0964537-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
filingDate | 1995-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4b211de01b69e5819e79ce55752c07c |
publicationDate | 1997-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H0964537-A |
titleOfInvention | Multilayer printed wiring board and method of manufacturing the same |
abstract | (57) Abstract: A multilayer printed wiring board having a high-definition pattern and a manufacturing method capable of manufacturing such a multilayer printed wiring board by a transfer lamination method onto a substrate without including a photolithography process. And how to provide. SOLUTION: A conductive pattern, an insulating layer and an adhesive photosensitive resin are removed by sequentially performing an operation of transferring a wiring pattern layer provided on a wiring pattern layer transfer plate onto a substrate, for a plurality of wiring pattern layer transfer plates. Multilayer printed wiring by forming a wiring pattern layer, which is a laminate including a resin layer formed by curing or a conductive layer and an insulating resin layer formed by curing an adhesive insulating photosensitive resin, on a substrate. Use as a board. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6893904-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6326698-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7166925-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6544821-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6861763-B2 |
priorityDate | 1995-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.