| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate |
1995-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c073546f2eefd5a0962402278fa29e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d1bde031a899bb32ed2e15887015374
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e79b238473bacbf9022592846297eceb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ef9b2199e66e4bc2415c714b07f862a |
| publicationDate |
1997-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0959521-A |
| titleOfInvention |
Thermosetting resin composition |
| abstract |
(57) [PROBLEMS] To obtain a highly reliable resin-encapsulated semiconductor device which can be highly filled with a filler, has good moldability and prevents the occurrence of resin cracks during IR reflow. SOLUTION: A first resin composition containing 85 to 95% by weight of a filler and having no local minimum point due to a change in the real part of the complex elastic modulus at the time of heat curing, and a complex elastic modulus at the time of heat curing. And a second resin composition having a local minimum point due to the change of the real part of the above, and each resin composition region is mixed with each other. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012058109-A |
| priorityDate |
1995-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |