| abstract |
(57) [Abstract] [Purpose] A novel thermosetting resin with flame retardancy that does not generate volatile components during curing, compared to compounds having a dihydrobenzoxazine ring known so far. Also has higher toughness and faster curing property, it is possible to change the softening temperature of the resin in a wide range by changing the molecular weight, and it is possible to form a film from a liquid thermosetting composition like a thermoplastic resin. Curable resin composition capable of being used in various forms to form a cured product having low hygroscopicity and excellent heat resistance and the like, a composite molding material, and a laminate and wiring using the same Provide a substrate. [Structure] A phenol compound having a structural unit A represented by the following formula (A), a method for producing the same, and an epoxy resin composition using this compound as a curing agent. Embedded image (However, R 1 is a methyl group, a cyclohexyl group, a phenyl group or a substituted phenyl group, and the hydrogen atom of the aromatic ring of the structural unit A is an arbitrary substituent except one of the ortho positions of the hydroxyl group of the structural unit A. It may be substituted with a group.) |