| abstract |
(57) [Summary] The platform carries, interconnects and provides uniform and adjusted adhesive thickness to handle and align integrated circuits (ICs) (20) through wire bonding or tape automated bonding operations. Supports the shielded IC. The platform base (10) has a flat portion, which may have a slot (30) extending the length of the chip with the wire bond pads (140). The IC is attached to the platform base with cast or contained adhesive, epoxy or tape (50), which has at least one adhesive surface. Several slots are provided for several rows of wire bond pads. If the platform carries more than one chip, the platform base will have more than one slot (30, 40) per chip. The platform can carry other elements (110, 120). The circuit (90) can be printed on one or both sides of the platform base and has an intermediate resistivity to dampen the ringing of the noise signal. Wirebonds are provided through the slots (30) to connect the IC pads to the circuit. The platform base may have conductive area portions (90) on one or both sides, forming a bus connected by shields or wire bonds. |