| abstract |
(57) [Summary]nThe present invention relates generally to a multi-layer packaging structure that (1) has a fairly wide range of sealing temperatures and (2) provides a seal that opens easily even at very high heat-sealing temperatures. More specifically, the film of the present invention is preferably a multilayer structure having a support film such as polyester, a homopolymer or copolymer interface layer, and a heat seal outer layer. |