| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316 |
| filingDate |
1995-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1997-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09501020-A |
| titleOfInvention |
Semiconductor wafer processing method |
| abstract |
(57) [Summary] A semiconductor wafer in which a short-chain polymer is deposited on the wafer to planarize the surface properties of the wafer, and a diffusion layer is deposited on the polymer layer surface to release water from the polymer at a controlled rate. Processing method. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7923383-B2 |
| priorityDate |
1994-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |