| abstract |
(57) Abstract: To obtain a photosensitive polyimide resin having a high molecular weight, transparency, moisture-resistant adhesion, high sensitivity and excellent cured film properties. A tetracarboxylic acid derivative having a photosensitive group (component A), 2,2-bis [4- (4-aminophenoxy) phenyl] sulfone (component B), 1,3-bis (3-aminopropyl) ) -1,1,3,3-tetramethyldisiloxane (C component) and 4,4'-diaminodiphenyl ether (D component), a resin obtained by reacting with a diamine, which comprises (B), The molar ratio of (C) and (D) is 0.5 <(B) / ((B) + (C) + (D)) <0.9 in all diamine components. 9, 0.01 <(C) / ((B) + (C) + (D)) < 0.3, 0 ≦ (D) / ((B) + (C) + (D)) < A photosensitive polyimide resin which is 0.49. |