http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0934109-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7956e22c9a8643585801f1d4f0538a6f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 1995-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6dc4dd2360e24073c48be4b8b6af60d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f0e5c5e09a763f3f04e5a8233a94839 |
| publicationDate | 1997-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0934109-A |
| titleOfInvention | Photosensitive resin composition and cured film forming method using the same |
| abstract | (57) Abstract: A photosensitive resin composition suitable for use as a solder resist for a printed wiring board, in which a symbol mark is easily formed, a pattern having high reliability and good adhesion is obtained. And a method for forming a cured film using the same. SOLUTION: (A) a prepolymer having an ethylenic bond-containing group and a carboxyl group, (B) a reactive diluent, (C) Thermosetting compound, (D) Radical polymerization initiator that is photosensitive at a light absorption wavelength of 450 to 700 nm, (E) 20 A photosensitive resin composition comprising a radical polymerization initiator which is photosensitive at a light absorption wavelength of 0 to 400 nm and (F) a dye which generates a radical by irradiation with light and develops a color, and the composition on a substrate. Provide a coating film consisting of 450-700 After marking exposure with laser light of nm, 200-400 patterning exposure with UV light of nm and then developing to form a cured coating. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100795112-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2005100472-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4681542-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020021900-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005100472-A1 |
| priorityDate | 1995-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 165.