| abstract |
(57) Abstract: (a) a polyimide compound, (b) a phenol resin having at least two OH groups in a molecule and having at least one naphthalene skeleton, and (d) at least a molecule. A resin composition containing an epoxy resin having two or more epoxy groups, further comprising (e) a compound having at least one active hydrogen in the molecule, (f) a molecular weight A thermosetting resin composition containing 5,000 to 100,000 linear polymers and / or (g) a polyfunctional cyanate ester, and a resin composition containing a curing accelerator, a flame retardant, a filler, and an additive. . A thermosetting resin laminate, comprising a prepreg in which a base material is impregnated with the resin composition or a varnish obtained by dissolving the resin composition in a solvent, and one or more prepregs formed by laminating. [Effect] A thermosetting resin composition having excellent heat resistance, low hygroscopicity, mechanical properties such as bending strength, and solder heat resistance after moisture absorption, and is effective as a resin material for laminated boards. |