Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-455 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 |
filingDate |
1996-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31b26d21d9502567db3d3641eea13f42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2394b3ad122ad550e916922735f09768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0032833ea088a4cbf39ee842931c6614 |
publicationDate |
1997-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H093195-A |
titleOfInvention |
Flexible wiring board |
abstract |
(57) Abstract: A flexible wiring board having a small number of curls and formed with a heat-resistant and electrically insulating polymer film firmly adhered to the board is provided. SOLUTION: The aromatic polyimide film provided with wiring is soluble in an organic solvent and has a thermal decomposition starting temperature of 324 ° C. or higher, The warp radius of curvature is 25.6 mm or more, and the elongation is 73 to 509. The present invention relates to a flexible wiring board in which a cured film is formed by heating and drying a coating film that gives a polymer film containing mm of copolymerized polyimide siloxane under conditions in which the wiring is not substantially deteriorated. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002012667-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7796845-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7822302-B2 |
priorityDate |
1996-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |