http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0931156-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1995-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b280d12b47fcbcbafa354dd7a30f84c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_572d6646a763b21f842b471f8f0ee6ff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_857a858428dd6c4189a7b99b23c99808 |
| publicationDate | 1997-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0931156-A |
| titleOfInvention | Epoxy resin composition and semiconductor encapsulating material |
| abstract | (57) [Summary] [Structure] A dicyclopentadiene type epoxy resin having a maximum absorbance of 0.25 or less in the wavelength range of 3570 to 3600 cm -1 measured by FT-IR of a 3% dichloromethane solution. An epoxy resin composition and a semiconductor encapsulating material containing an epoxy resin having a hydroxyl group content defined by a value. [Effect] The epoxy resin composition is excellent in curability during molding and heat resistance of the cured product, and the semiconductor encapsulating material is also excellent in solder crack resistance during surface mounting. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009191200-A |
| priorityDate | 1995-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.