| abstract |
(57) 【Abstract】 PROBLEM TO BE SOLVED: To form a pattern with high precision by photolithography, and to obtain a photosensitive resin composition which is excellent in folding resistance, solder heat resistance, flame retardancy, and coating workability on a film. And to provide a photosensitive laminate using this composition. SOLUTION: (A) A carboxylic acid-containing polyamide resin (c) obtained by reacting a polyvalent carboxylic acid component (a) containing a polytetramethylene glycol-modified dicarboxylic acid as an essential component with a diisocyanate (b). In contrast, the epoxy resin (d) has an equivalent ratio (d) / (c) of 1 Photosensitive resin composition containing epoxy group-containing polyamide resin obtained by reaction under the above conditions, (B) epoxy resin and (C) photocationic polymerization initiator, and this composition A photosensitive laminate formed by laminating the layers of. |