| abstract |
(57) Abstract: A liquid crystal encapsulating resin composition comprising an epoxy resin, a rubber, a curing agent, a curing accelerator, a coupling agent, a filler and a solvent. In the resin composition, the curing agent is an organic acid hydrazide compound, and the amount thereof is 0.1 to 1.0 primary amino groups of the curing agent per epoxy group of the epoxy resin; the curing accelerator is an organic dibasic acid ( Adipic acid, sebacic acid, etc.) in an amount of 0.2 to 20 parts by weight based on 100 parts by weight of the total of the epoxy resin, rubber, curing agent and coupling agent. [Effect] A highly reliable cell for liquid crystal encapsulation can be obtained under low temperature and short time heat curing conditions (eg, 120 ° C. in an oven for 30 minutes). This contributes to energy saving and cost reduction in the process. |