http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09292440-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f804c60a1aa732ef57edc3f5a60371e2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 1996-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b3aa0b03328f856473958e1635b5065 |
| publicationDate | 1997-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09292440-A |
| titleOfInvention | Resin mold removal method |
| abstract | (57) Abstract: To reduce the risk of resin mold removal work and the risk of damage to electronic components, and to improve the workability of resin mold removal work. SOLUTION: In step S1, an electronic component covered with a resin mold is heated in water to activate the resin mold of the exterior of the electronic component. In step S2, the heated electronic component is immersed in an organic solvent to swell the resin mold with the organic solvent. In step S3, the resin mold swollen with the organic solvent is peeled off or ground to remove it from the electronic component. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11097449-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018213432-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11745392-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10647028-B2 |
| priorityDate | 1996-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.