| abstract |
PROBLEM TO BE SOLVED: To provide a low-cost laminated board for a printed wiring board having high Tg, high moisture resistance and heat resistance, and high reliability. A thermosetting resin composition comprising a layer formed by impregnating and curing a thermosetting resin composition varnish containing a thermosetting resin in a fibrous base material and a circuit metal layer. (A) a thermosetting resin having a dihydrobenzoxazine ring, (b) a halogenated compound, and (c) A laminate for a printed wiring board, which is a resin composition containing a crosslinked elastomer in which some of the structural units of the main chain are crosslinked by the structural units. |