| abstract |
(57) [Abstract] [Purpose] Copper-clad laminate used for electronic circuit boards such as high-speed arithmetic circuits and high-frequency circuits, and encapsulating materials, molding materials, casting materials, adhesives, electrical insulating paints, etc. used for electronic parts. It is an object of the present invention to provide an epoxy resin composition suitable for [Structure] An epoxy resin obtained by reacting an epoxy resin having an alcoholic hydroxyl group equivalent of 1.0 meq / g or less with an isocyanate compound having two or more isocyanate groups in the molecule is an essential component, and a general formula ( An epoxy resin composition comprising a phenol resin represented by 1). Embedded image |