http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0927587-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38520f366e74704305b34fb93a81121e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 1995-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f26a91486d3ebeba58b1a878e74fc6e3 |
| publicationDate | 1997-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0927587-A |
| titleOfInvention | Lead frame, semiconductor device, and method for manufacturing semiconductor device |
| abstract | (57) Abstract: [PROBLEMS] To provide a lead frame capable of mounting a semiconductor element of any size, thereby reducing the manufacturing cost of a semiconductor device. A frame main body (10) having a plurality of inner leads (11) and having an opening (12) for arranging a semiconductor element at a position surrounded by the tips of the inner leads (11), and an outer shape larger than the contour of the opening (12). Have An insulating tape 16 for mounting a semiconductor element is provided on the plurality of inner leads 11 so as to cover the openings 12. The insulating tape 16 is provided with slits 17 extending directly above the inner leads 11 and extending over all of the plurality of inner leads 11 in a discontinuous manner along the circumferential direction of the opening 12. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6265760-B1 |
| priorityDate | 1995-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.