| abstract |
(57) Abstract: A conductive paste used for mounting an IC chip on a substrate, which is free of stickiness in the B stage and can be stored or transported for a long time in that state, and then I A conductive paste that can be mounted with an IC chip by placing a C chip on it and curing it so that the user does not need to apply it. SOLUTION: (A) 40 to 60 parts by weight of a bisphenol A type epoxy resin having an epoxy equivalent of 450 to 2000, and 10 to 40 of a bisphenol A type epoxy resin having an epoxy equivalent of 180 to 210. 100 parts by weight of an epoxy resin composed of 20 to 50 parts by weight of a novolac type epoxy resin, (B) a curing agent composed of 2 to 6 parts by weight of an aromatic diamine and 6 to 12 parts by weight of dicyandiamide, and (C) a conductive material. A conductive epoxy resin composition comprising 25 to 55 parts by weight of powder. |