| abstract |
(57) [Abstract] [Problem] Excellent resist properties such as sensitivity and resolution, To provide a polyimide-based photosensitive resin composition having high storage stability, a relatively low curing temperature, and excellent film physical properties. SOLUTION: (A) Terminal modification is carried out with an aminobenzene or trimellitic acid derivative having a substituent having a photopolymerizable carbon-carbon double bond in the molecule, and a photosensitive group is added to the main chain skeleton. Introduced polyamic acid compound, (B) A photosensitive resin composition containing a photosensitizer having a photopolymerizable functional group, (C) a photopolymerization initiator, and (D) a solvent. |