| abstract |
(57) [Abstract] [Purpose] To improve the storage stability and moldability of an epoxy resin composition suitable for a laminate material, an electronic component encapsulating material, and the like. An epoxy resin composition comprising an epoxy resin, particularly preferably a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin and a naphthalene type epoxy resin, and a tetra-substituted phenyl borate of quaternary phosphonium as a curing accelerator. [Effect] Compared with conventional epoxy resin compositions, it has excellent storage stability and moldability, and has the excellent effect of giving a cured product with low hygroscopicity and high adhesiveness, and is used as a material for laminates and electronic parts. When used, the reliability of the product can be improved. |