| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f2e1eed951518d6a42752736e3fd3afb |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 |
| filingDate |
1996-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3926793c3fcb8639eed9d202bca46766
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d74dccbad65aa04882d6ad6e7213bca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_069550e4af6b0ab34ad6b26b650938e1 |
| publicationDate |
1997-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09241884-A |
| titleOfInvention |
Ni-P alloy electroplating method |
| abstract |
(57) Abstract: [PROBLEMS] To provide a plating method capable of efficiently obtaining a Ni-P alloy electroplating film having a small fluctuation of P content and effectively utilizing a waste liquid of chemical Ni-P plating. In a Ni-P alloy electroplating method, A Ni-P alloy electroplating method, which comprises electrolyzing in a state where a cathode current density applied to the cathode is in the range of 0.1 to 20 A / dm 2 and vibration is applied. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008542180-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010232439-A |
| priorityDate |
1996-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |