| abstract |
(57) Abstract: A water-based epoxy resin curable composition having excellent storage stability. SOLUTION: (I) (A) number average molecular weight 400 to 2 10,000 polyethylene glycol (a), bisphenol type epoxy resin (b), compound (c) having one active hydrogen in one molecule, compound having two or more active isocyanate groups in one molecule (D), an amine addition modified epoxy resin obtained by the reaction of an amine compound (e) having active hydrogen, (B) an active hydrogen-containing hydrophobic polyamine compound, and an aqueous epoxy resin curing agent comprising water and (II) epoxy An aqueous epoxy resin curable composition, characterized in that it is mixed with an aqueous resin dispersion. |