http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09237974-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f09378c018e7719f171f7e91f2dd60fd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 |
| filingDate | 1996-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a3dada57365a46cfd5bdba6814eb6fc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_774c9ada1ffb7ee142d567db777078e4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1fa55102d499ef6bd3a33191fcc5650 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d029d89c4dcc76265759dfb51d2cfd1 |
| publicationDate | 1997-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09237974-A |
| titleOfInvention | Multilayer wiring board, method for producing the same, transfer master used for producing the multilayer wiring board, and method for producing the same |
| abstract | (57) Abstract: A multilayer wiring board having a high-definition pattern, and a manufacturing method capable of manufacturing such a multilayer wiring board by a transfer lamination method onto a substrate without including a photolithography step. Provided is a transfer original plate that enables industrially advantageous production of this multilayer wiring board, and a method for producing the same. An insulating layer having a desired pattern is formed on a conductive substrate having at least a conductive surface, and a conductive layer and an insulating resin layer are laminated on an exposed portion of the conductive surface of the conductive substrate to form a transfer master plate. , A conductive layer and an insulating resin are obtained by sequentially performing the operation of transferring the wiring pattern layer, which is composed of the conductive layer and the insulating resin layer provided on the transfer original plate, onto the substrate with respect to the plurality of wiring pattern layer transfer plates. A wiring pattern layer having layers is laminated on a substrate to form a multilayer wiring board. |
| priorityDate | 1996-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 120.