http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09237648-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6572309f22e2ad56c1390a78ac237bed
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
filingDate 1996-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ba2d168e27b562b5bb66336bda811ae
publicationDate 1997-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H09237648-A
titleOfInvention Connection structure between heat seal connector and board using this
abstract (57) [Abstract] (Correction) [PROBLEMS] To provide a heat-seal connector that facilitates connection between circuit boards, expands the degree of freedom in designing each board, simplifies the structure, and saves volume. A connection structure between substrates using this is provided. SOLUTION: This heat seal connector 1 is provided with conductive lines 4 and 5 groups on both front and back surfaces of a flexible base material 3 having a square cutout portion 2, and one end of each conductive line 4 and 5 group is provided. First and second connection portions 6 and 7 are formed on each of two sides forming the rectangular cutout portion 2, and the other end of the conductive line group on one surface passes through the flexible base material 3. The third connecting portion 9 is provided at the end of each of the conductive lines 4 and 5 extending to the side of the conductive line group on the other surface.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007026846-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008090155-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4579074-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100522320-B1
priorityDate 1996-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID423443469
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14311
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419554492
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8054
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7406
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410492784
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426025815
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4275592
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524931
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412495863
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID408510678
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7822
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414867529
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7958
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID54048897
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414862845
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522923
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8210
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10989
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8034
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414875457
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12348

Total number of triples: 43.