| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33b0b64188290f92bf8998f8090575e5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20 |
| filingDate |
1996-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01ae84fc0e4fdc0c722dd7576ca61083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7114bb90ad21b0eb05e066549f775abc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_448a86c763f08e9456544a8a4fa04d1d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb4f22b7f5ab77c9ea6249b053f7e8ef |
| publicationDate |
1997-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09235686-A |
| titleOfInvention |
Method for cleaning and modifying surface for solder joint and method for soldering |
| abstract |
(57) Abstract: An electronic component that does not use a flux, does not require a large-scale device with high running cost such as a vacuum device, and has high reliability even when the packaging density is higher. To provide a method for cleaning a solder joint surface, a method for modifying a solder joint surface, and a soldering method capable of providing a mounting board. A method of irradiating at least two members to be soldered with atmospheric pressure low temperature plasma to clean at least a surface of the members for soldering. Soldering 2 A method of irradiating at least one member with atmospheric-temperature low-temperature plasma using a fluorine-containing gas to clean at least the surface of the member for soldering and forming a fluorine-containing layer on the surface. A method of supplying molten solder to the surface cleaned or formed with a fluorine-containing layer by the above method, or supplying non-molten solder, and then melting the non-melted solder to solder between the members. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002059071-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017005280-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018204054-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009030163-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010267895-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014170816-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004030077-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007069266-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4727793-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013141016-A |
| priorityDate |
1996-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |