http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09232505-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-04
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filingDate 1996-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01ef7b5fe91947be4352e46b4059831a
publicationDate 1997-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H09232505-A
titleOfInvention Manufacturing method of multi-chip module and multi-chip module
abstract (57) [Abstract] [PROBLEMS] To provide a multi-chip module that enhances versatility and reduces cost. SOLUTION: A plurality of wiring board elements 4 and a plurality of integrated circuit chips 3 on which wiring patterns are formed are provided on a support base 2, and a plurality of wiring board elements 4 are connected to each other to form a wiring pattern as a whole. Or a plurality of wiring pattern elements are formed on the wiring board 4, and the wiring pattern elements selected from the plurality of wiring pattern elements are electrically connected to each other to form a predetermined wiring pattern. The substrate and the integrated circuit chip 3 are configured to be electrically connected.
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priorityDate 1996-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 21.