http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09228059-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate | 1996-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_398e91fa6dbe1567b92366efd66f204e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a355fe05bebdd271e0f043c1056f9293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46e7a3ecae6ded2979dc30b90dc79ade |
| publicationDate | 1997-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09228059-A |
| titleOfInvention | Electroless plating method |
| abstract | (57) Abstract: An electroless plating method of depositing a noble metal compound on the surface of a resin molded product, activating it by plasma treatment, and then performing electroless plating, which can be treated under normal pressure, and Provided is an electroless plating method in which the adhesion between the surface of a resin molded body and a plating film is high. A method of depositing and activating a noble metal compound is to apply a liquid containing a noble metal compound and a compound having resin permeability to a surface of a resin molding, and then use a gas plasma excited at normal pressure to perform normal pressure. It is a method of performing plasma treatment in. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1886801-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1886801-A4 |
| priorityDate | 1996-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.