http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09227699-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate | 1996-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05335da89bb674790ced731abca0be60 |
| publicationDate | 1997-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09227699-A |
| titleOfInvention | Manufacturing method of prepreg |
| abstract | (57) 【Abstract】 PROBLEM TO BE SOLVED: To obtain a substrate having a boiling point of 150 after primary impregnation with a solvent. A method for producing a prepreg that is produced by secondary impregnation with an epoxy resin-based resin varnish containing a solvent having a temperature of ℃ or more, and then by heating and drying, when a laminate is produced using the prepreg, molding is performed at a low pressure. Even if it provides the manufacturing method of the prepreg which can obtain the laminated board with few residual air bubbles. SOLUTION: The boiling point of the solvent used for primary impregnation is 90 to 155 ° C. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6555174-B2 |
| priorityDate | 1996-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.