| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K305-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
| filingDate |
1996-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bc22af2db765879dbd9b9953735ee43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76a27cdf0381318bc73ffeae7e6e50b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71f016c8bf67285134caa4676bbf086e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b5cb32572d10ce0b53a651e4ce4d8c7 |
| publicationDate |
1997-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09225948-A |
| titleOfInvention |
Epoxy resin molding for electrical insulation |
| abstract |
(57) Abstract: [PROBLEMS] To provide a high-strength epoxy resin molded product for electrical insulation, which has excellent adhesive strength between an epoxy resin cured product forming a molded product and an embedded metal fitting. An epoxy resin molded product for electrical insulation, in which an embedded metal fitting is embedded in a cured epoxy resin body. Moreover, a bonding layer made of a silane compound is formed at the contact interface between the cured epoxy resin and the embedded metal fitting. |
| priorityDate |
1996-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |