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filingDate 1996-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_602a5fc5738819ab532d3659431364f8
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publicationDate 1997-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H09223668-A
titleOfInvention Semiconductor substrate and method for processing semiconductor substrate
abstract (57) Abstract: A method for treating a semiconductor substrate, which effectively reduces precipitates on the surface of a semiconductor substrate on which a semiconductor single crystal film is formed and enables formation of an oxide film having a long dielectric breakdown life. To provide. A semiconductor substrate is not etched on the surface of the semiconductor substrate, and a step of selectively etching the semiconductor substrate is performed under the condition that a precipitate exposed on the surface of the semiconductor substrate is etched. And a step of forming a single crystal film of a semiconductor which constitutes the semiconductor.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005123241-A
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priorityDate 1995-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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