http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09216937-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 |
| filingDate | 1996-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_916645032689c21ef3173219a552a5f4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0abfb96ada501215a6b3cc06fe28fd0 |
| publicationDate | 1997-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09216937-A |
| titleOfInvention | Epoxy resin composition and electronic component sealing device |
| abstract | (57) [Abstract] [Problem] There is little influence of moisture absorption, and in particular, it has excellent solder heat resistance, moisture resistance, and moldability after immersion in a solder bath, and there is no peeling from a semiconductor chip or lead frame or generation of cracks in internal resin. Further, the present invention provides an epoxy resin composition and an electronic component encapsulating device which can ensure long-term reliability without causing electrode corrosion or leak current. SOLUTION: The whole resin composition comprises A) an epoxy resin, (B) a novolac type phenolic resin, (C) an inorganic filler, (D) a curing accelerator and (E) both terminal aminoalkyl polysiloxanes as essential components. To (C) filler An electronic component sealing device comprising an epoxy resin composition containing 25 to 95% by weight and (E) polysiloxane of 0.01 to 2.0% by weight, and a cured product of the composition sealing an electronic component. Is. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8563662-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011236303-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8569425-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008055042-A1 |
| priorityDate | 1996-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.