http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09208911-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0773 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 1996-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acc8ade55f845c83a9af0c24818b8ae1 |
| publicationDate | 1997-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H09208911-A |
| titleOfInvention | Adhesive for electroless plating and multilayer printed wiring board |
| abstract | (57) Abstract: In an adhesive for electroless plating, heat-resistant resin particles soluble in an acid or an oxidizing agent are dispersed in an uncured liquid of a heat-resistant resin that is hardly soluble in an acid or an oxidizing agent. The heat-resistant resin that is hardly soluble in the acid or the oxidant contains a photosensitive resin obtained by sensitizing a thermosetting resin, does not contain a thermoplastic resin, and is in an uncured liquid of the heat-resistant resin. Is an adhesive for electroless plating, characterized in that it contains a liquid curing agent at 25 ° C., and a multilayer print having an interlayer insulating material layer made of a resin obtained by curing the adhesive for electroless plating. Wiring board. [Effect] According to the adhesive for electroless plating and the multilayer printed wiring board of the present invention, connection reliability can be ensured, and disconnection due to pits can be prevented even in the case of a via hole having a small diameter of less than 100 μm, and high temperature. The interlayer insulation can be secured even when used under high humidity. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004096937-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6359035-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013237849-A |
| priorityDate | 1996-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 76.