| abstract |
(57) Abstract: A main component of at least one surface of an organic film having heat resistance is a copolymer of ethylene and an acrylate and / or methacrylate monomer and maleic acid and / or maleic anhydride. A heat-resistant protective film having a thermosetting adhesive layer. [Effects] The heat-resistant protective film of the present invention has good adhesiveness to an organic film, excellent flexibility, and high quality, and can be easily manufactured with good workability, and is obtained from a copper-clad laminate or a copper-clad laminate obtained therefrom. It is useful for protecting circuit boards. |